3301 - Electroconductive Resin Is a nonsolvent type. Is used for general adhesion. Is used for dot-adhesion or surface adhesion.

3301F  - Electroconductive Resin Is a solvent-diluted type of 3301E. Has excellent durability against heat. Is a solvent type. Is used for adhesion of electronic components.

3302 B is a soft type of 3302. Is highly flexible. Is a solvent type. Is used for adhesion of electronic components. Is used for dot-adhesion.

Adhesive for HDD magnetic heads ThreeBond 3305C is an adhesive for assembling the magnetic heads of HDDs. It not only bonds the slider core to the suspension, but discharges static electricity from the magnetic head, to prevent it from being damaged by the static electricity. Used to fix the slider core of an HDD by curing under ultraviolet irradiation; actually hardens with heat. After curing, the adhesive is soft and has a low Young's modulus (flexural elasticity); therefore it does not exhibit the crowning that conventional adhesives are subject to. Because the resin contains silver powder, the adhesive is conductive enough to discharge magnetic heads. Bonding the slider core to the suspension in a magnetic head Discharging magnetic heads

Microencapsulated, anisotropically-conductive adhesive for bare-chip mounting ThreeBond 3372C is a microencapsulated, anisotropically conductive resin for use in mounting bare chips. It cures when heated to 230°C for 3 seconds. A fine pitch connection can be obtained with it, because it uses a microencapsulated conductive filler with spherical silver particles that are all of the same size and that are coated in resin that has excellent dielectricity and moisture resistance. Because it cures much faster than conventional adhesives, it can contribute to productivity. Has connection resistance that is lower and more stable than that of gold-plated resin balls. Makes 4000 mA of conduction available at an 80 μm bump. Makes fine pitch connection possible, because the coating of the conductive particles isolates them from one another. Facilitates mounting, because the electrical connection and the resin sealing take place at the same time. Bare chip mounting by the pressure-bonding method

Anisotropically-conductive adhesive for screen printing 3373C.  As electronic devices have become smaller and lighter, many components have become much denser. Examples are high-capacity, high-density displays such as LCD displays. ThreeBond 3373C is an anisotropically conductive adhesive for use in screen printing, which enables an adhesive to form efficiently an anisotropically conductive layer on a high density, multiterminal circuit. One of its most important merits is that it can be managed more easily than a thermal-curing film of anisotropically conductive adhesive, because the temperature allowable at pressure-bonding can be as high as 120 to 160°C. This adhesive is especially suitable for the connection and bonding of liquid crystal panels and membrane switches. Makes screen printing possible, so that the adhesive fits the parts being connected. Makes it possible to connect many contacts at the same time. Provides good connection to transparent conductive glasses, which cannot be soldered. Unlike conductive rubber and metal-wired rubber, requires no compressed fixing after adhesion. Connection of liquid crystal panels with boards Connection of membrane switches Connection of EL backlight terminals

Two-part, epoxy-based, electroconductive adhesive ThreeBond 3380B is a two-part, epoxy-based conductive adhesive with a very little outgas, which has been developed for electronics and electronic parts. The product cures at about 60°C. Is a silver-based conductive adhesive with epoxy resin or curing agent used as a binder. Has stable adhesion for metal materials. Is a nonsolvent type that leaves no solvent residue in the adhesive. Is ideal for sealing because of the low outgassing. Cures at low temperature, 60 to 80°C. Connecting electrodes in various electronics and electronic parts Dot adhesion and fixing of electronic chips